ANJI MICROELECTRONICS (SHANGHAI) CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C09K MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR293
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 165
 
  
 
C09G POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES116

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8038749 Composition for removing photoresist layer and method for using itMay 12, 06Oct 18, 11[C09G]
7947195 Polishing slurryMay 15, 06May 24, 11[C09K]
7776231 Chemical mechanical polishing slurries, their applications and method of use thereofApr 19, 06Aug 17, 10[C09K]
7052373 Systems and slurries for chemical mechanical polishingJan 19, 05May 30, 06[B24B]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2009/0095,320 Composition for Removing Photresist Layer and Method for Using itAbandonedMay 12, 06Apr 16, 09[B08B, G03F]
2006/0118,760 Slurry composition and methods for chemical mechanical polishingAbandonedDec 03, 04Jun 08, 06[C09K]
2006/0084,271 Systems, methods and slurries for chemical mechanical polishingAbandonedOct 20, 04Apr 20, 06[H01L, C23F, B44C]

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